Thermaltake TG-50 Thermal Paste

TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.

High Thermal Conductivity:
- With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate.

Easy to Apply:
- Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.

All-In-One Application Kit:
- This thermal compound application kit includes a set of easily-applied tools for immediate use.

Sustainability and Safety:
- The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use.
Non-electrical conductive compound ensures better safety measures for you and your system.


Specifications:

- Thermal conductivity:8 w/m-k
- Weight:4g
- Viscosity:47 pa-s
- Thermal impedance:0.035°c -in²/w
- Density:2.9 g/cm³

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